VP, Advanced Packaging Technology

The Group You’ll Be A Part Of

In the Global Products Group, we are dedicated to excellence in the design and engineering of Lam's etch and deposition products. We drive innovation to ensure our cutting-edge solutions are helping to solve the biggest challenges in the semiconductor industry. 

The Impact You’ll Make

Technology leadership position for the Advanced Packaging business group to provide insights and direction on Advanced Packaging technology trends and their implications for Lam’s product portfolio. Provides leadership for external eco-system engagements that support next generation advanced packaging technology development. ​

What You’ll Do

AP technology strategy & roadmap

Establish and implement a comprehensive technology roadmap for advanced packaging solutions, aligning with market trends, customer requirements, and industry megatrends (e.g., AI, 3DIC, hybrid bonding, panel-level packaging)

Product development & engineering

Work closely with product teams to guide the development of advanced packaging solutions​

Ensure products meet performance, reliability, and cost targets, addressing customer needs and market competitiveness

Customer engagement

Engage with and understand customers’ technology roadmaps and challenges, provide insightful perspectives that influence customers roadmaps, oversee co-development efforts

Strategic partnership & ecosystem engagement

Ownership for academic institutions, and industry consortia relationships and Lam sponsored programs​

Represent the company at industry events, conferences, and panels to promote technological leadership

Preferred Qualifications

• Leadership role in the Semiconductor industry, with a focus on advanced packaging technologies and FE/BE process integration
• Deep engagement with Tier-1 end customers (e.g., foundry, IDM, memory players), and proven success in fab/equipment company leadership, ideally within the packaging domain
• Expertise in hybrid bonding, with demonstrated impact from a fab operations, design enablement, or equipment innovation perspective
• Proven track record of leading the development and commercialization of advanced packaging solutions, from concept through HVM
• Extensive ecosystem influence, including active participation in industry consortia, strategic partnerships, and global customer engagements requiring significant travel
• Recognized as an industry thought leader, with a history of shaping technology roadmaps and presenting at major conferences

Our Commitment

We believe it is important for every person to feel valued, included, and empowered to achieve their full potential. By bringing unique individuals and viewpoints together, we achieve extraordinary results.

Lam Research ("Lam" or the "Company") is an equal opportunity employer. Lam is committed to and reaffirms support of equal opportunity in employment and non-discrimination in employment policies, practices and procedures on the basis of race, religious creed, color, national origin, ancestry, physical disability, mental disability, medical condition, genetic information, marital status, sex (including pregnancy, childbirth and related medical conditions), gender, gender identity, gender expression, age, sexual orientation, or military and veteran status or any other category protected by applicable federal, state, or local laws. It is the Company's intention to comply with all applicable laws and regulations. Company policy prohibits unlawful discrimination against applicants or employees.

Lam offers a variety of work location models based on the needs of each role. Our hybrid roles combine the benefits of on-site collaboration with colleagues and the flexibility to work remotely and fall into two categories – On-site Flex and Virtual Flex. ‘On-site Flex’ you’ll work 3+ days per week on-site at a Lam or customer/supplier location, with the opportunity to work remotely for the balance of the week. ‘Virtual Flex’ you’ll work 1-2 days per week on-site at a Lam or customer/supplier location, and remotely the rest of the time.